Dimensions (WxHxD, mm)
2U 4 Nodes - Rear access
440 x 87.5 x 475
Motherboard
MZ12-HD0 Rev. 3.0
CPU
AMD EPYC™ 7003 series processor family
Single processor, 7nm technology
Up to 64-core, 128 threads per processor
TDP up to 225W, cTDP up to 240W
Conditional support 280W
Compatible with AMD EPYC™ 7002 series processor family
Socket
Per Node:
1 x LGA 4094
Total:
4 x LGA 4094
Socket SP3
Chipset
System on Chip
Memory
Per node:
8 x DIMM slots
Total:
32 x DIMM slots
DDR4 memory supported only
8-Channel memory architecture
RDIMM modules up to 128GB supported
LRDIMM modules up to 128GB supported
3DS RDIMM/LRDIMM modules up to 256GB supported
Memory speed: Up to 3200 MHz
LAN
Per node:
2 x 1GbE LAN ports (1 x Intel® I350-AM2)
1 x Dedicated management port
Total:
8 x 1GbE LAN ports (1 x Intel® I350-AM2)
4 x Dedicated management ports
Video
Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM
Audio
N/A
Storage
Per node:
1 x 2.5" NVMe hot-swappable SSD bays
Total:
4 x 2.5" NVMe hot-swappable SSD bays
All storage bays are compatible with SATA devices
SAS
N/A
RAID
N/A
Peripheral Drives
N/A
Expansion Slots
Per node:
1 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus)
1 x Low profile half-length slots with PCIe x16 (Gen3 x16 bus)
1 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
2 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Total:
4 x Low profile half-length slots with PCIe x16 (Gen4 x16 bus)
4 x Low profile half-length slots with PCIe x16 (Gen3 x16 bus)
4 x OCP 2.0 mezzanine slot with PCIe Gen3 x16 bandwidth (Type1, P1, P2, P3, P4 with NCSI supported)
8 x M.2 slots:
- M-key
- PCIe Gen3 x4
- Supports NGFF-2242/2260/2280/22110 cards
- CPU TDP is limited to 155W if using M.2 device
Internal I/O
Per node:
2 x M.2 slot
1 x USB 3.0 header
1 x TPM header
1 x OCP 2.0 mezzanine slots
1 x Front panel header
1 x Back plane board header
1 x IPMB connector
1 x Clear CMOS jumper
1 x BIOS recovery jumper
Front I/O
Per node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button
Total:
4 x Power button with LED
4 x ID button with LED
4 x Status LED
4 x Reset button
Rear I/O
Per node:
2 x USB 3.0
1 x VGA
2 x RJ45
1 x MLAN
1 x ID LED
Total:
8 x USB 3.0
4 x VGA
8 x RJ45
4 x MLAN
4 x ID LEDs
Backplane I/O
4 x ports
Speed and bandwidth: SATA 6Gb/s or SAS 12Gb/s or PCIe Gen3 x4 per port
TPM
1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply
2 x 1200W redundant PSUs
80 PLUS Platinum
AC Input:
- 100-240V~/ 12-7A, 50-60Hz
DC Input:
- 240Vdc/ 6A
DC Output:
- Max 1000W/ 100-240V~
+12V/ 80.5A
+12Vsb/ 3A
- Max 1200W/ 200-240V~ or 240Vdc input
+12V/ 97A
+12Vsb/ 3A
System Management
Aspeed® AST2500 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
Dashboard
JAVA Based Serial Over LAN
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings
OS Compatibility
Windows Server 2016 ( X2APIC/256T not supported)
Windows Server 2019
Red Hat Enterprise Linux 8.3 ( x64) or later
SUSE Linux Enterprise Server 12 SP5 ( x64) or later
SUSE Linux Enterprise Server 15 SP2 ( x64) or later
Ubuntu 18.04.5 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
VMware ESXi 6.7 Update3 P03 or later
VMware ESXi 7.0 Update1 or later
Citrix Hypervisor 8.2.0 or later
System Fans
3 x 80x80x38mm (16,300rpm)
1 x 40x40x28mm (25,000rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Ambient temperature limited to 30°C if using 280W CPU
Packaging Dimensions
857 x 670 x 280 mm
Packaging Content
1 x H242-Z10
4 x CPU heatsinks
1 x Rail Kit
Part Numbers
Barebone package: 6NH242Z10MR-00 Rev. A00
Spare parts:
- Motherboard: 9MZ12HD0NR-00
- Back plane board: 9CBPH043NR-00
- Rail kit: 25HB2-AA6107-K0R
- CPU heatsink: 25ST1-44320J-A0R
- Back plane board: 9CBPH043NR-00
- Fan module: 25ST2-44282D-D0R/ 25ST2-88382E-D0R
- CMC Kit: 6NH242Z12SR-00
- M.2 Heatsink kit: 6NH242Z17SR-00-100 (in option)
- Power Supply: 25EP0-212007-F3S
